About Us

Checon Shivalik

Checon Shivalik Contact Solutions is a joint venture unit formed with the alliance of Shivalik Bimetal Controls Ltd., (India) and Checon Corporation (USA). Incorporated in 2006, the partnership’s main motive was to combine, the expertise of Shivalik in the field of joining dissimilar metals by Hot/Cold bonding, electron beam welding, solder reflow and manufacturing Thermostatic bimetal components, and the expertise of Checon in the field of making high quality Silver and Silver Alloy based electrical contact materials and assemblies, using world class equipment and professional manpower clubbed with over four decades of experience in the field.

Both partner companies are market leaders in their respective areas of operation.


This strategic alliance will enable the users of Silver and Silver alloy based contact materials and assemblies in India and abroad to have access to high quality products at competitive pricing and a team to provide complete solutions and ways to use precious and non-ferrous metals in the most cost effective manner, making "effective material utilization and giving complete contact solutions" the core competency of the company.

CSCS has its world class manufacturing facility, based in Solan (Himachal Pradesh, India), using the latest technological processes to manufacture these critical materials and components.

The team at CSCS will be more than enthusiastic to help you with all your electrical contact needs.

Checon Shivalik Contact Solutions has made a mark in the electrical contact market as a proven supplier of finished contact assemblies.


Manufacturing Unit

Checon Shivalik

Checon Shivalik’s manufacturing facility is located among the picturesque himalayan foothills on the highway between Solan and Shimla in Himachal Pradesh, India. Set up in 2011, this ISO 9001 certified facility houses modern manufacturing equipment to join various types of precious contact materials with base metals using different technologies such as welding, brazing, riveting and bonding.